Abstract: Embodiments herein describe techniques for a semiconductor device including a substrate, a first inter-level dielectric (ILD) layer above the substrate, and a second ILD layer above the first ILD layer. A first capacitor and a second capacitor are formed within the first ILD layer and the second ILD layer. A first top plate of the first capacitor and a second top plate of the second capacitor are formed at a boundary between the first ILD layer and the second ILD layer. The first capacitor and the second capacitor are separated by a dielectric area in the first ILD layer. The dielectric area includes a first dielectric area that is coplanar with the first top plate or the second top plate, and a second dielectric area above the first dielectric area and to separate the first top plate and the second top plate. Other embodiments may be described and/or claimed.

Abstract: Systems, apparatuses and methods may provide for technology that identifies a NUMA node, defines a first virtual proximity domain within the NUMA node, and defines a second virtual proximity domain within the NUMA node, wherein the first virtual proximity domain and the second virtual proximity domain are defined via one or more OS interface tables.

Abstract: Examples described herein relate to a computing system supporting custom page sized ranges for an application to map contiguous memory regions instead of many smaller sized pages. An application can request a custom range size. An operating system can allocate a contiguous physical memory region to a virtual address range by specifying a custom range sizes that are larger or smaller than the normal general page sizes. Virtual-to-physical address translation can occur using an address range circuitry and translation lookaside buffer in parallel. The address range circuitry can determine if a custom entry is available to use to identify a physical address translation for the virtual address. Physical address translation can be performed by transforming the virtual address in some examples.

Abstract: According to one embodiment, a method comprises executing an untrusted host virtual machine monitor (VMM) to manage execution of at least one guest virtual machine (VM). The VMM receives an encrypted key domain key, an encrypted guest code image, and an encrypted guest control structure. The VM also issues a create command. In response, a processor creates a first key domain comprising a region of memory to be encrypted by a key domain key. The encrypted key domain key is decrypted to produce the key domain key, which is inaccessible to the VMM. The VMM issues a launch command. In response, a first guest VM is launched within the first key domain. In response to a second launch command, a second guest VM is launched within the first key domain. The second guest VM provides an agent to act on behalf of the VMM. Other embodiments are described and claimed.

Abstract: Technologies for performing random sparse lifting and Procrustean orthogonal sparse hashing using column read-enabled memory include a device that has a memory that is column addressable and circuitry connected to the memory. The circuitry is configured to add a set of input data vectors to the memory as a set of binary dimensionally expanded vectors, including multiplying each input data vector with a projection matrix. The circuitry is also configured to produce a search hash code from a search data vector, including multiplying the search data vector with the projection matrix. Further, the circuitry is configured to determine a Hamming distance between the search hash code and each of the binary dimensionally expanded vectors.

Abstract: Techniques are disclosed for reducing or eliminating loop overhead caused by function calls in processors that form part of a pipeline architecture. The processors in the pipeline process data blocks in an iterative fashion, with each processor in the pipeline completing one of several iterations associated with a processing loop for a commonly-executed function. The described techniques leverage the use of message passing for pipelined processors to enable an upstream processor to signal to a downstream processor when processing has been completed, and thus a data block is ready for further processing in accordance with the next loop processing iteration. The described techniques facilitate a zero loop overhead architecture, enable continuous data block processing, and allow the processing pipeline to function indefinitely within the main body of the processing loop associated with the commonly-executed function where efficiency is greatest.

Abstract: In a memory system, a memory device has a memory array with multiple rows of memory having logical addresses mapped to their physical addresses and at least one spare row not having a logical address mapped to its physical address. A controller detects a failure of one of the multiple rows of memory (“failure row”) and executes a post package repair (PPR) mode. The controller can be internal to the memory device or external to the memory device. The memory device includes an internal scratchpad to allow transfer of data contents from the failure row to the spare row. The controller can map the logical address of the failure row from the physical address of the failure row to the physical address of the spare row, transfer data contents from the failure row to the internal scratchpad, and transfer the data contents from the internal scratchpad to the spare row.

Abstract: Systems, apparatuses and methods may provide for technology that detects a low battery condition in a computing system including an integrated graphics processor and a discrete graphics processor, wherein the low battery condition is detected during a pre-boot stage of the computing system. The technology may also disable a root port associated with the discrete graphics processor in response to the low battery condition, conduct an initialization of an integrated display while the root port is disabled, and enable the root port in response to a successful negotiation of increased power by a verified read write code of an embedded controller of the computing system.

Abstract: Embodiments described herein provide a system, method, and apparatus to accelerate reduce operations in a graphics processor. One embodiment provides an apparatus including one or more processors, the one or more processors including a first logic unit to perform a merged write, barrier, and read operation in response to a barrier synchronization request from a set of threads in a work group, synchronize the set of threads, and report a result of an operation specified in association with the barrier synchronization request.

Abstract: Apparatus and method for performing low-latency multi-job submission via a single job descriptor is described herein. An apparatus embodiment includes a plurality of descriptor queues to stores job descriptors describing work to be performed and enqueue circuitry to receive a first job descriptor which includes a first field to store a Single Instruction Multiple Data (SIMD) width. If the SIMD width indicates that the first job descriptor is an SIMD job descriptor and open slots are available in the descriptor queues to store new job descriptors, then the enqueue circuitry is to generate a plurality of job descriptors based on fields of the first job descriptor and to store them in the open slots of the descriptor queues. The generated job descriptors are processed by processing pipelines to perform the work described. At least some of the generated job descriptors are processed concurrently or in parallel by different processing pipelines.

Abstract: Disclosed embodiments relate to atomic memory operations. In one example, a method of executing an instruction atomically and with weak order includes: fetching, by fetch circuitry, the instruction from code storage, the instruction including an opcode, a source identifier, and a destination identifier, decoding, by decode circuitry, the fetched instruction, selecting, by a scheduling circuit, an execution circuit among multiple circuits in a system, scheduling, by the scheduling circuit, execution of the decoded instruction out of order with respect to other instructions, with an order selected to optimize at least one of latency, throughput, power, and performance, and executing the decoded instruction, by the execution circuit, to: atomically read a datum from a location identified by the destination identifier, perform an operation on the datum as specified by the opcode, the operation to use a source operand identified by the source identifier, and write a result back to the location.

Abstract: A method and system of image processing with multi-skeleton tracking uses a temporal object key point loss metric.

Abstract: Embodiments of a package substrate includes: a conductive via in a first layer, the first layer comprising a positive-type photo-imageable dielectric; a conductive trace in a second layer, the second layer comprising a negative-type photo-imageable dielectric; and an insulative material between the first layer and the second layer, the insulative material configured to absorb electromagnetic radiation in a wavelength range between 10 nanometers and 800 nanometers. The conductive via is directly attached to the conductive trace through the insulative material, the positive-type photo-imageable dielectric is soluble in a photoresist developer upon exposure to the electromagnetic radiation, and the negative-type photo-imageable dielectric is insoluble in the photoresist developer upon exposure to the electromagnetic radiation.

Abstract: Disclosed herein are tools and methods for subtractively patterning metals. These tools and methods may permit the subtractive patterning of metal (e.g., copper, platinum, etc.) at pitches lower than those achievable by conventional etch tools and/or with aspect ratios greater than those achievable by conventional etch tools. The tools and methods disclosed herein may be cost-effective and appropriate for high-volume manufacturing, in contrast to conventional etch tools.

Abstract: An apparatus includes a central processing unit (CPU), including a plurality of processing cores, each having a cache memory, a fabric interconnect coupled to the plurality of processing cores and cryptographic circuitry, coupled to the fabric interconnect including mesh stop station to receive memory data and determine a destination of the memory data and encryption circuitry to encrypt/decrypt the memory data based on a destination of the memory data.

Abstract: Computer computation of correctly rounded floating point summation is described. An example of apparatus includes a first circuit to sort multiple floating point (FP) values based on an exponent of each FP value and store the sorted FP values in a buffer, and to provide the plurality of FP values for summation sequentially in a sorted order starting with a FP value having a smallest exponent; a second circuit to iteratively sum the FP values and store an accumulated value, generate and store a residual value representing fully resolved bits from the accumulator, and generate an intermediate output including the residual value; and a third circuit to perform final rounding of the output, the final rounded output being a correctly rounded summation of the maximum floating point values.

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

Abstract: A first die has a port to couple the first die to a second die over a die-to-die interconnect. The port includes circuitry to implement a physical layer of the die-to-die interconnect, send first protocol identification data over the physical layer to identify a first protocol in a plurality of protocols, send first data over the interconnect to the second die, wherein the first data comprise data of the first protocol, send second protocol identification data over the physical layer to identify a different second protocol in the plurality of protocols, and send second data over the interconnect to the second die, wherein the second data comprise flits of the second protocol.

Abstract: One embodiment provides for a computer-readable medium storing instructions that cause one or more processors to perform operations comprising determining a per-layer scale factor to apply to tensor data associated with layers of a neural network model and converting the tensor data to converted tensor data. The tensor data may be converted from a floating point datatype to a second datatype that is an 8-bit datatype. The instructions further cause the one or more processors to generate an output tensor based on the converted tensor data and the per-layer scale factor.

Abstract: Disclosed herein are source/drain regions in integrated circuit (IC) structures, as well as related methods and components. For example, in some embodiments, an IC structure may include: an array of channel regions, including a first channel region and an adjacent second channel region; a first source/drain region proximate to the first channel region; a second source/drain region proximate to the second channel region; and an insulating material region at least partially between the first source/drain region and the second source/drain region.

Abstract: A bumpless hybrid organic glass interposer. One or more high density pattern (HDP) routing layers are placed on a functional, thin, carrier, separate from the intended organic substrate patch or package. The HDP layer(s) is/are then attached to the substrate package. The interposers achieve electrical connections between the HDP layer and underlying routing layer of the substrate package by utilizing a self-align dry etch process through landing pads connected to the HDP routing.

Abstract: Described herein is a truncated modified Booth squarer that is commutative and accurate to 1 unit in the last place. In various embodiments, the truncated Booth squarer is a radix-4 Booth squarer or a radix-8 Booth squarer. The truncated Booth squarer can be included within integer, floating-point, or fixed-point units within a graphics processor or compute accelerator, including matrix accelerator units or tensor processors.

Abstract: Embodiments described herein include software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. One embodiment provides for data aware sparsity via compressed bitstreams. One embodiment provides for block sparse dot product instructions. One embodiment provides for a depth-wise adapter for a systolic array.

Abstract: Embodiments of a microelectronic assembly includes: an interposer comprising a first portion in contact along an interface with a second portion; a first integrated circuit (IC) die embedded in a dielectric material in the first portion of the interposer; and a second IC die coupled to the first portion of the interposer opposite to the second portion, wherein: the second portion comprises a glass substrate with a channel within the glass substrate, a portion of the channel has an opening at the interface, a conductive pad in the first portion is exposed in the opening, and the conductive pad is coupled to a circuit in at least one of the first IC die or the second IC die.

Abstract: In an example, an apparatus comprises a plurality of execution units comprising at least a first type of execution unit and a second type of execution unit and logic, at least partially including hardware logic, to expose embedded cast operations in at least one of a load instruction or a store instruction; determine a target precision level for the cast operations; and load the cast operations at the target precision level. Other embodiments are also disclosed and claimed.

Abstract: A computing platform comprising a plurality of disaggregated data center resources and an infrastructure processing unit (IPU), communicatively coupled to the plurality of resources, to compose a platform of the plurality of disaggregated data center resources for allocation of micro service s cluster.

Abstract: An apparatus to facilitate increasing processing resources in processing cores of a graphics environment is disclosed. The apparatus includes a plurality of processing resources to execute one or more execution threads; a plurality of message arbiter-processing resource (MA-PR) routers, wherein a respective MA-PR router of the plurality of MA-PR routers corresponds to a pair of processing resources of the plurality of processing resources and is to arbitrate routing of a thread control message from a message arbiter between the pair of processing resources; a plurality of local shared cache (LSC) sequencers to provide an interface between at least one LSC of the processing core and the plurality of processing resources; and a plurality of instruction caches (ICs) to store instructions of the one or more execution threads, wherein a respective IC of the plurality of ICs interfaces with a portion of the plurality of processing resources.

Abstract: A non-linear activation function may be approximated by linear functions. The input range of the activation function may be divided into input segments. One or more input segments may be selected based on statistical analysis of input data elements in the input range. A parameter of a first linear function that approximates the activation function for at least part of a selected input segment may be stored in a first portion of a first look-up table (LUT). The first portion of the first LUT is dedicated to a first group of post processing engines (PPEs). A parameter of a second linear function that approximates the activation function for at least part of an unselected input segment may be stored in a shared pool of LUT entries, which includes a second portion of the first LUT and a portion of a second LUT and is shared by multiple groups of PPEs.

Abstract: Embodiments are generally directed to memory prefetching in multiple GPU environment. An embodiment of an apparatus includes multiple processors including a host processor and multiple graphics processing units (GPUs) to process data, each of the GPUs including a prefetcher and a cache; and a memory for storage of data, the memory including a plurality of memory elements, wherein the prefetcher of each of the GPUs is to prefetch data from the memory to the cache of the GPU; and wherein the prefetcher of a GPU is prohibited from prefetching from a page that is not owned by the GPU or by the host processor.

Abstract: Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.

Abstract: A computer platform is disclosed. The computer platform comprises a central processing unit (CPU) including at least one socket having a plurality of tiles and control circuitry to partition the socket into a plurality of sub-sockets and assign a unique identity to each of the plurality of sub-sockets for security verification, wherein each sub-socket comprises at least one of the plurality of tiles to operate as a cluster of resources.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to enhance and audio signal.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: An embodiment of an electronic apparatus may include one or more substrates, and logic coupled to the one or more substrates, the logic to allocate a first memory portion to a first application as a combination of a local memory and remote memory, wherein the remote memory is shared between multiple compute nodes, and manage a first memory balloon associated with the first memory portion based on two or more memory tiers associated with the local memory and the remote memory. Other embodiments are disclosed and claimed.

Abstract: For example, an Extremely High Throughput (EHT) wireless communication station (STA) may be configured to set a Resource Unit (RU) allocation subfield in an EHT Signal (SIG) field to indicate an RU assignment for an Orthogonal Frequency Division Multiple Access (OFDMA) EHT Physical layer (PHY) Protocol Data Unit (PPDU) according to a predefined RU allocation table, the RU assignment for the OFDMA EHT PPDU comprising a Multiple Resource Unit (MRU) comprising a plurality of RUs; and transmit the OFDMA EHT PPDU comprising the EHT SIG field.

Abstract: Hyperchip structures and methods of fabricating hyperchips are described. In an example, an integrated circuit assembly includes a first integrated circuit chip having a device side opposite a backside. The device side includes a plurality of transistor devices and a plurality of device side contact points. The backside includes a plurality of backside contacts. A second integrated circuit chip includes a device side having a plurality of device contact points thereon. The second integrated circuit chip is on the first integrated circuit chip in a device side to device side configuration. Ones of the plurality of device contact points of the second integrated circuit chip are coupled to ones of the plurality of device contact points of the first integrated circuit chip. The second integrated circuit chip is smaller than the first integrated circuit chip from a plan view perspective.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a first die having a first surface and an opposing second surface, wherein the first die is embedded in a first dielectric layer, wherein the first surface of the first die is coupled to the second surface of the package substrate, and wherein the first dielectric layer is between a second dielectric layer and the second surface of the package substrate; a second die having a first surface and an opposing second surface, wherein the second die is embedded in the second dielectric layer, and wherein the first surface of the second die is coupled to the second surface of the package substrate by a conductive pillar; and a shield structure that at least partially surrounds the conductive pillar.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having channel structures with sub-fin dopant diffusion blocking layers are described. In an example, an integrated circuit structure includes a fin having a lower fin portion and an upper fin portion. The lower fin portion includes a dopant diffusion blocking layer on a first semiconductor layer doped to a first conductivity type. The upper fin portion includes a portion of a second semiconductor layer, the second semiconductor layer on the dopant diffusion blocking layer. An isolation structure is along sidewalls of the lower fin portion. A gate stack is over a top of and along sidewalls of the upper fin portion, the gate stack having a first side opposite a second side. A first source or drain structure at the first side of the gate stack.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces on an edge of the package. In other implementations, off-package bandwidth for a particular edge of a package may use both an optical fanout and an electrical fanout on the same edge of the package. In embodiments, the optical fanout may use a top surface or side edge of a die and the electrical fanout may use the bottom side edge of the die. Other embodiments may be described and/or claimed.

Abstract: Field effect transistors having field effect transistors having gate dielectrics with dipole layers and having gate stressor layers, and methods of fabricating field effect transistors having gate dielectrics with dipole layers and having gate stressor layers, are described. In an example, an integrated circuit structure includes a semiconductor channel structure including a monocrystalline material. A gate dielectric is over the semiconductor channel structure, the gate dielectric including a high-k dielectric layer on a dipole material layer, and the dipole material layer distinct from the high-k dielectric layer. A gate electrode has a workfunction layer on the high-k dielectric layer, the workfunction layer including a metal. A first source or drain structure is at a first side of the gate electrode. A second source or drain structure is at a second side of the gate electrode opposite the first side.

Abstract: Techniques are disclosed for using neural network architectures to estimate predictive uncertainty measures, which quantify how much trust should be placed in the deep neural network (DNN) results. The techniques include measuring reliable uncertainty scores for a neural network, which are widely used in perception and decision-making tasks in automated driving. The uncertainty measurements are made with respect to both model uncertainty and data uncertainty, and may implement Bayesian neural networks or other types of neural networks.

Abstract: In one embodiment, an apparatus includes: a first queue to store requests that are guaranteed to be delivered to a persistent memory; a second queue to store requests that are not guaranteed to be delivered to the persistent memory; a control circuit to receive the requests and to direct the requests to the first queue or the second queue; and an egress circuit coupled to the first queue to deliver the requests stored in the first queue to the persistent memory even when a power failure occurs. Other embodiments are described and claimed.

Abstract: Systems and methods described herein may relate to providing a dynamically configurable circuitry able to process data associated with a variety of matrix dimensions using one or more complex number operations, one or more real number operations, or both. Configurations may be applied to the configurable circuitry to program the configurable circuitry for a next operation. The configurable circuitry may process data according to a variety of operations based at least in part on operation of a repeated processing element coupled in a compute network of processing elements.

Abstract: Examples described herein include a system comprising: a processing unit package comprising: at least one core and at least one offload processing device communicatively coupled inline between the at least one core and a network interface controller, the at least one offload processing device configurable to perform packet processing. In some examples, the at least one offload processing device is to allow mapping of packet processing pipeline stages of networking applications among software running on the at least one core and the at least one offload processing device to permit flexible entry, exit, and re-entry points among the at least one core and the at least one offload processing device.

Abstract: In one embodiment, memory cell includes a control gate, a floating gate, a substrate comprising a source region and a drain region, a first isolator between the control gate and floating gate, and a second isolator between the floating gate and the substrate. The memory cell is configured to have a retention time that is within a statistical window around a selected lifespan. The selected lifespan may be less than ten years, such as, for example, less than one year, less than one month, or less than one week.

Abstract: Disclosed herein are non-planar transistor (e.g., nanoribbon) arrangements having asymmetric gate enclosures on at least one side. An example transistor arrangement includes a channel material shaped as a nanoribbon, and a gate stack wrapping around at least a portion of a first face of the nanoribbon, a sidewall, and a portion of a second face of the nanoribbon. Portions of the gate stack provided over the first and second faces of the nanoribbon extend in a direction parallel to the longitudinal axis of the nanoribbon for a certain distance that may be referred to as a “gate length.” A portion of the gate stack wrapping around the sidewall of the nanoribbon does not extend along the entire gate length, but, rather, extends over less than a half of the gate length, e.g., about one third of the gate length, thus making the gate enclosure on that sidewall asymmetric.

Abstract: Techniques, structures, and materials related to extreme ultraviolet (EUV) lithography are discussed. Multiple patterning inclusive of first patterning a grating of parallel lines and second patterning utilizing EUV lithography to form plugs in the grating, and optional trimming of the plugs may be employed. EUV resists, surface treatments, resist additives, and optional processing inclusive of plug healing, angled etch processing, electric field enhanced post exposure bake are described, which provide improved processing reliability, feature definition, and critical dimensions.

Abstract: Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough.

Abstract: An apparatus to facilitate compression of memory data is disclosed. The apparatus comprises one or more processors to receive uncompressed data, adapt a format of the uncompressed data to a compression format, perform a color transformation from a first color space to a second color space, perform a residual computation to generate residual data, compress the residual data via entropy encoding to generate compressed data and packing the compressed data.

Abstract: Various methods and devices for positioning autonomous agents including verifying a reported agent location using physical attributes of the received signal; improving agent formation for iterative localization; selecting agents for distributed task sharing; intelligent beacon-placement for group localization; relative heading and orientation determination utilizing time of flight; and secure Instrument Landing System (ILS) implementation for unmanned agents.