Intel Patents Granted

Patents granted to Intel by the U.S. Patent and Trademark Office (USPTO).

  • Patent number: 11997619
    Abstract: Representative implementations of devices and techniques provide communication between networked nodes operating on a communication network medium. In an implementation, a node generates a broadcast frame that includes at least a preamble and a payload. The preamble of the broadcast frame may include auxiliary information. The auxiliary information may be associated with one or more symbols of the preamble. The auxiliary information may contain power boost information.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: May 28, 2024
    Assignee: Intel Germany GmbH & Co. KG
    Inventors: Joon Bae Kim, Vladimir Oksman
  • Patent number: 11996853
    Abstract: Described is an apparatus which comprises: a first clocking source having a first divider; a second clocking source having a second divider, wherein the first and second clocking sources are inductively coupled; and calibration logic to monitor clock signals associated with the first and second clocking sources and to generate at least one calibration code for adjusting at least one divider ratio of the first or second dividers according to the monitored clock signals.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: May 28, 2024
    Assignee: INTEL CORPORATION
    Inventor: Amit Kumar Srivastava
  • Patent number: 11997539
    Abstract: There is disclosed example techniques to include obtaining a filtering rule via a control plane message that includes information to identify a source of a general packet radio service (GPRS) tunneling protocol (GTP) user-plane (GTP-U) packet. The example techniques also include configuring, based on the information to identify the source, a virtual switch to identify the source of the GTP-U packet to use in the filtering rule to cause a received GTP-U packet to be sent to a local edge server or a mobile core network for processing based on at least a portion of a first extension header included in the GTP-U packet.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventor: Yifan Yu
  • Patent number: 11996967
    Abstract: Various embodiments herein provide techniques for reference signal (RS) configuration for high frequency bands (e.g., frequency above 52.6 GHz). For example, embodiments may include techniques for configuration of a demodulation reference signal (DM-RS), a channel state information reference signal (CSI-RS), and/or a sounding reference signal (SRS). The RS configuration may provide a low peak-to-average power ratio (PAPR) compared to prior techniques. Other embodiments may be described and claimed.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Avik Sengupta, Alexei Davydov
  • Patent number: 11996992
    Abstract: Various systems and methods for providing opportunistic placement of compute in an edge network are described herein. A node in an edge network may be configured to access a service level agreement related to a workload, the workload to be orchestrated for a user equipment by the node; modify a machine learning model based on the service level agreement; implement the machine learning model to identify resource requirements to execute the workload in a manner to satisfy the service level agreement; initiate resource assignments from a resource provider, the resource assignments to satisfy the resource requirements; construct a resource hierarchy from the resource assignments; initiate execution of the workload using resources from the resource hierarchy; and monitor and adapt execution of the workload based on the resource hierarchy in response to the execution of the workload.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Ned M. Smith, S M Iftekharul Alam, Satish Chandra Jha, Vesh Raj Sharma Banjade, Christian Maciocco, Kshitij Arun Doshi, Francesc Guim bernat, Nageen Himayat
  • Patent number: 11997039
    Abstract: Various embodiments herein provide physical uplink control channel (PUCCH) designs for discrete Fourier transform-spread-orthogonal frequency-division multiplexing (DFT-s-OFDM) waveforms for systems operating above the 52.6 GHz carrier frequency. Some embodiments of the present disclosure may be directed to phase tracking reference signal (PT-RS) design for PUCCH with carrier frequencies above 52.6 GHz. Other embodiments may be disclosed and/or claimed.
    Type: Grant
    Filed: July 5, 2023
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Gang Xiong, Seunghee Han, Alexei Davydov, Daewon Lee
  • Patent number: 11996814
    Abstract: An active filter and an analog-to-digital converter (ADC) configured to suppress out-of-band peaking. An active filter may include an active device configured to provide a power gain to an input signal, a feedback network configured to connect an output of the active device to an input of the active device, and an input impedance network configured to couple the input signal to the input of the active device. A combination of the feedback network and the input impedance network is configured to provide frequency response properties of the active filter such that a frequency domain signal transfer function of the active filter has a constant in numerator.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Matteo Camponeschi, Lukas Doerrer, Patrick Torta
  • Patent number: 11996404
    Abstract: A monolithic three-dimensional integrated circuit may include multiple transistor levels separated by one or more levels of metallization. An upper level transistor structure may include a monocrystalline channel material over a bottom gate stack. The channel material and the gate stack materials may be formed on a donor substrate at any suitable temperature, and subsequently transferred from the donor substrate to a host substrate that includes lower-level circuitry. The upper-level transistor may be patterned from the transferred layers so that the gate electrode includes one or more bonding layers. Source and drain material may be patterned from a source and drain material layer that was transferred from the donor substrate along with the channel material, or source and drain material may be grown at low temperatures from the transferred channel material.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Kimin Jun, Willy Rachmady, Zachary Geiger, Cory Bomberger, Ryan Keech, Koustav Ganguly, Anand Murthy, Jack Kavalieros
  • Patent number: 11995462
    Abstract: Techniques for transferring virtual machines and resource management in a virtualized computing environment are described. In one embodiment, for example, an apparatus may include at least one memory, at least one processor, and logic for transferring a virtual machine (VM), at least a portion of the logic comprised in hardware coupled to the at least one memory and the at least one processor, the logic to generate a plurality of virtualized capability registers for a virtual device (VDEV) by virtualizing a plurality of device-specific capability registers of a physical device to be virtualized by the VM, the plurality of virtualized capability registers comprising a plurality of device-specific capabilities of the physical device, determine a version of the physical device to support via a virtual machine monitor (VMM), and expose a subset of the virtualized capability registers associated with the version to the VM. Other embodiments are described and claimed.
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Sanjay Kumar, Philip R. Lantz, Kun Tian, Utkarsh Y. Kakaiya, Rajesh M. Sankaran
  • Patent number: 11994615
    Abstract: Apparatuses, methods and storage medium associated with compensating for a sensor deficiency in a heterogeneous sensor array are disclosed herein. In embodiments, an apparatus may include a compute device to aggregate perception data from individual perception pipelines, each of which is associated with respective one of different types of sensors of a heterogeneous sensor set, to identify a characteristic associated with a space to be monitored by the heterogeneous sensor set; detect a sensor deficiency associated with a first sensor of the sensors; and in response to a detection of the sensor deficiency, derive next perception data for more than one of the individual perception pipelines from sensor data originating from at least one second sensor of the sensors. Other embodiments may be disclosed or claimed.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Ignacio Alvarez, David Arditti Ilitzky, Patrick Andrew Mead, Javier Felip Leon, David Gonzalez Aguirre
  • Patent number: 11995006
    Abstract: A method comprises generating, for a cacheline, a first tag and a second tag, the first tag and the second tag generated as a function of user data stored and metadata in the cacheline stored in a first memory device, and a multiplication parameter derived from a secret key, storing the user data, the metadata, the first tag and the second tag in the first cacheline of the first memory device; generating, for the cacheline, a third tag and a fourth tag, the third tag and the fourth tag generated as a function of the user data stored and metadata in the cacheline stored in a second memory device, and the multiplication parameter; storing the user data, the metadata, the third tag and the fourth tag in the corresponding cache line of the second memory device; receiving, from a requesting device, a read operation directed to the cacheline; and using the first tag, the second tag, the third tag, and the fourth tag to determine whether a read error occurred during the read operation.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Sergej Deutsch, Karanvir Grewal, David M. Durham, Rajat Agarwal
  • Patent number: 11997847
    Abstract: Embodiments herein describe techniques for a semiconductor device including a TFT having a gate electrode with a gate length determined by a spacer. Embodiments may include a gate electrode above a substrate, a channel layer above the gate electrode, and a source electrode, a drain electrode, and a spacer above the channel layer. The drain electrode may be separated from the source electrode by the spacer. The drain electrode and the source electrode may have different widths or include different materials. Furthermore, the spacer may overlap with the gate electrode, hence the gate length of the gate electrode may be determined by the spacer width. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Abhishek A. Sharma, Van H. Le, Gilbert Dewey, Shriram Shivaraman, Yih Wang, Tahir Ghani, Jack T. Kavalieros
  • Patent number: 11995018
    Abstract: Embodiments of the present disclosure may relate to the existence of a unique value associated with each PCIe function or device that is readable from two or more PCIe functions, or from a CPU running system software. Embodiments enable system software to identify which PCIe functions have private or hidden connections. In addition, embodiments may allow system software to differentiate among multiple identical instances of PCIe add-in components that have associations. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Marcus Winston, Matthew A. Schnoor
  • Patent number: 11995330
    Abstract: Technologies for providing accelerated functions as a service in a disaggregated architecture include a compute device that is to receive a request for an accelerated task. The task is associated with a kernel usable by an accelerator sled communicatively coupled to the compute device to execute the task. The compute device is further to determine, in response to the request and with a database indicative of kernels and associated accelerator sleds, an accelerator sled that includes an accelerator device configured with the kernel associated with the request. Additionally, the compute device is to assign the task to the determined accelerator sled for execution. Other embodiments are also described and claimed.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Evan Custodio, Susanne M. Balle, Joe Grecco, Henry Mitchel, Rahul Khanna, Slawomir Putyrski, Sujoy Sen, Paul Dormitzer
  • Patent number: 11995022
    Abstract: A universal serial bus (USB) router can include a display port input device to receive a display port signal. The display port input device can include display port link layer parser circuitry to identify display port control or data information from the received display port signal, USB packet construction circuitry to construct a USB packet comprising the display port control or data information identified by the display port link layer parser circuitry, and a USB switch to transmit the USB packet comprising the display control or data information over a USB link. A display port output device can include display port packetizer circuitry to construct a display port packet from the display port control or data information from the USB packet, and display port output circuitry to output the display port packet across a display port link.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Ziv Kabiry, Reuven Rozic, Gal Yedidia
  • Patent number: 11995767
    Abstract: Apparatus and method for compression of acceleration structure build data in a ray tracing implementation. For example, one embodiment of an apparatus comprises: traversal hardware logic to traverse rays through a graphics scene comprising a plurality of primitives; and an acceleration data structure processing unit comprising: a bounding box compressor to compress a set of bounding boxes to generate a plurality of bounding box compression blocks, and an index compressor to compress a set of indices to generate a plurality of index compression blocks, and an acceleration data structure builder for constructing acceleration structures based on bounding box compression blocks and index compression blocks.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Michael Doyle, Sreenivas Kothandaraman
  • Patent number: 11995183
    Abstract: Systems, apparatuses, and methods to response to detected attacks in an autonomous system based on context of the autonomous system are described. In particular, the disclosure provides an intrusion detection system receiving contexts and contracts dictating particular response guide rails from a higher level components or stack on the autonomous system. The intrusion detection system is arranged to respond to attacks according to the contract without intervention by the higher level components or stack.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: May 28, 2024
    Assignee: INTEL CORPORATION
    Inventors: Marcio Juliato, Shabbir Ahmed, Christopher Gutierrez, Vuk Lesi, Manoj Sastry, Qian Wang
  • Patent number: 11995001
    Abstract: A processor for supporting secure memory intent is disclosed. The processor of the disclosure includes a memory execution unit to access memory and a processor core coupled to the memory execution unit. The processor core is to receive a request to access a convertible page of the memory. In response to the request, the processor core to determine an intent for the convertible page in view of a page table entry (PTE) corresponding to the convertible page. The intent indicates whether the convertible page is to be accessed as at least one of a secure page or a non-secure page.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Krystof C. Zmudzinski, Siddhartha Chhabra, Uday R. Savagaonkar, Simon P. Johnson, Rebekah M. Leslie-Hurd, Francis X. McKeen, Gilbert Neiger, Raghunandan Makaram, Carlos V. Rozas, Amy L. Santoni, Vincent R. Scarlata, Vedvyas Shanbhogue, Ilya Alexandrovich, Ittai Anati, Wesley H. Smith, Michael Goldsmith
  • Patent number: 11995028
    Abstract: Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Chee Hak Teh, Yu Ying Ong, George Chong Hean Ooi
  • Patent number: 11994932
    Abstract: Methods and apparatus for platform ambient data management schemes for tiered architectures. A platform including one or more CPUs coupled to multiple tiers of memory comprising various types of DIMMs (e.g., DRAM, hybrid, DCPMM) is powered by a battery subsystem receiving input energy harvested from one or more green energy sources. Energy threshold conditions are detected, and associated memory reconfiguration is performed. The memory reconfiguration may include but is not limited to copying data between DIMMs (or memory ranks on the DIMMS in the same tier, copying data between a first type of memory to a second type of memory on a hybrid DIMM, and flushing dirty lines in a DIMM in a first memory tier being used as a cache for a second memory tier. Following data copy and flushing operations, the DIMMs and/or their memory devices are powered down and/or deactivated.
    Type: Grant
    Filed: June 21, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Karthik Kumar, Thomas Willhalm, Francesc Guim Bernat
  • Patent number: 11994997
    Abstract: Systems, apparatuses and methods may provide for a memory controller to manage quality of service enforcement and migration between local and pooled memory. A memory controller may include logic to communicate with a local memory and with a pooled memory controller to track memory page usage on a per application basis, instruct the pooled memory controller to perform a quality of service enforcement in response to a determination that an application is latency bound or bandwidth bound, wherein the determination that the application is latency bound or bandwidth bound is based on a cycles per instruction determination, and instruct a Direct Memory Access engine to perform a migration from a remote memory to the local memory in response to a determination that the quality of service cannot be enforced.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Karthik Kumar, Mark A. Schmisseur
  • Patent number: 11997192
    Abstract: Technologies for establishing device locality are disclosed. A processor in a computing device generates an identifier distinct to the computing device. The processor transmits the identifier to a management controller via a hardware bus in the computing device. The processor generates a key and encrypts the key with the identifier to generate a wrapped key. The processor transmits the wrapped key to the management controller. In turn, the management controller unwraps the key using the identifier. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: May 28, 2024
    Assignee: INTEL CORPORATION
    Inventors: Bo Zhang, Siddhartha Chhabra, William A. Stevens, Reshma Lal
  • Patent number: 11995029
    Abstract: Multi-tile Memory Management for Detecting Cross Tile Access, Providing Multi-Tile Inference Scaling with multicasting of data via copy operation, and Providing Page Migration are disclosed herein. In one embodiment, a graphics processor for a multi-tile architecture includes a first graphics processing unit (GPU) having a memory and a memory controller, a second graphics processing unit (GPU) having a memory and a cross-GPU fabric to communicatively couple the first and second GPUs. The memory controller is configured to determine whether frequent cross tile memory accesses occur from the first GPU to the memory of the second GPU in the multi-GPU configuration and to send a message to initiate a data transfer mechanism when frequent cross tile memory accesses occur from the first GPU to the memory of the second GPU.
    Type: Grant
    Filed: March 14, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Lakshminarayanan Striramassarma, Prasoonkumar Surti, Varghese George, Ben Ashbaugh, Aravindh Anantaraman, Valentin Andrei, Abhishek Appu, Nicolas Galoppo Von Borries, Altug Koker, Mike Macpherson, Subramaniam Maiyuran, Nilay Mistry, Elmoustapha Ould-Ahmed-Vall, Selvakumar Panneer, Vasanth Ranganathan, Joydeep Ray, Ankur Shah, Saurabh Tangri
  • Patent number: 11996447
    Abstract: Monolithic FETs including a fin of a first semiconductor composition disposed on a sub-fin of a second composition. In some examples, an InGaAs fin is grown over GaAs sub-fin. The sub-fin may be epitaxially grown from a seeding surface disposed within a trench defined in an isolation dielectric. The sub-fin may be planarized with the isolation dielectric. The fin may then be epitaxially grown from the planarized surface of the sub-fin. A gate stack may be disposed over the fin with the gate stack contacting the planarized surface of the isolation dielectric so as to be self-aligned with the interface between the fin and sub-fin. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Sean T. Ma, Matthew V. Metz, Willy Rachmady, Gilbert Dewey, Chandra S. Mohapatra, Jack T. Kavalieros, Anand S. Murthy, Tahir Ghani
  • Patent number: 11995737
    Abstract: Thread dispatch circuitry is configured to dispatch threads of a two-dimensional (2D) thread group based on data access locality associated with the threads. The thread dispatch circuitry can dispatch a first 2D sub-group of the 2D thread group to a compute block of the multiple compute blocks, the first 2D sub-group associated with a first 2D tile of memory and dispatch a second 2D sub-group of the 2D thread group to the compute block of the multiple compute blocks, the second 2D sub-group associated with a second 2D tile of memory.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Altug Koker, Balaji Vembu, Joydeep Ray, James A. Valerio, Abhishek R. Appu
  • Patent number: 11996702
    Abstract: Resonator control techniques for wireless power transmitting units are described. One or more novel parameters may be defined for use in conjunction with dominant PRU selection on the part of a PTU. In various embodiments, each of a plurality of PRUs may determine values for one or more such parameters, and may report those values to the PTU. In some embodiments, the PTU may identify a parameter to be used as a selection criterion, and may identify the dominant PRU based on the respective values reported for that parameter by the plurality of PRUs. Other embodiments are described and claimed.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: May 28, 2024
    Assignee: INTEL CORPORATION
    Inventors: Hooman Shirani-Mehr, Ahmad Khoshnevis
  • Patent number: 11996403
    Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment, a semiconductor device comprises a semiconductor substrate and a source. The source has a first conductivity type and a first insulator separates the source from the semiconductor substrate. The semiconductor device further comprises a drain. The drain has a second conductivity type that is opposite from the first conductivity type, and a second insulator separates the drain from the semiconductor substrate. In an embodiment, the semiconductor further comprises a semiconductor body between the source and the drain, where the semiconductor body is spaced away from the semiconductor substrate.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Nidhi Nidhi, Rahul Ramaswamy, Walid M. Hafez, Hsu-Yu Chang, Ting Chang, Babak Fallahazad, Tanuj Trivedi, Jeong Dong Kim, Ayan Kar, Benjamin Orr
  • Patent number: 11996362
    Abstract: Integrated circuit (IC) cell architectures including a crenellated interconnect trace layout. A crenellated trace layout may be employed where an IC cell includes transistor having a source/drain terminal interconnected through a back-side (3D) routing scheme that reduces front-side routing density for a given transistor footprint. In the crenellated layout, adjacent interconnect traces or tracks may have their ends staggered according to a crenellation phase for the cell. Crenellated tracks may intersect one cell boundary with adjacent tracks intersecting an opposite cell boundary. Track ends may be offset by at least the width of an underlying orthogonal interconnect trace. Crenellated track ends may be offset by the width of an underlying orthogonal interconnect trace and half a spacing between adjacent orthogonal interconnect traces.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Patrick Morrow, Mauro J. Kobrinsky, Mark T. Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar
  • Patent number: 11995184
    Abstract: A low-latency digital-signature with side-channel security is described. An example of an apparatus includes a coefficient multiplier circuit to perform polynomial multiplication, the coefficient multiplier circuit providing Number Theoretic Transform (NTT) and INTT (Inverse NTT) processing; and one or more accessory operation circuits coupled with the coefficient multiplier circuit, each of the one or more accessory operation circuits to perform a computation based at least in part on a result of an operation of the NTT/INTT coefficient multiplier circuit, wherein the one or more accessory operation circuits are to receive results of operations of the NTT/INTT coefficient multiplier circuit prior to the results being stored in a memory.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: May 28, 2024
    Assignee: INTEL CORPORATION
    Inventors: Santosh Ghosh, Andrea Basso, Manoj Sastry
  • Patent number: 11996411
    Abstract: Embodiments disclosed herein include stacked forksheet transistor devices, and methods of fabricating stacked forksheet transistor devices. In an example, an integrated circuit structure includes a backbone. A first transistor device includes a first vertical stack of semiconductor channels adjacent to an edge of the backbone. A second transistor device includes a second vertical stack of semiconductor channels adjacent to the edge of the backbone. The second transistor device is stacked on the first transistor device.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Cheng-Ying Huang, Gilbert Dewey, Anh Phan, Nicole K. Thomas, Urusa Alaan, Seung Hoon Sung, Christopher M. Neumann, Willy Rachmady, Patrick Morrow, Hui Jae Yoo, Richard E. Schenker, Marko Radosavljevic, Jack T. Kavalieros, Ehren Mannebach
  • Patent number: 11996408
    Abstract: Stacked transistor structures having a conductive interconnect between upper and lower transistors. In an embodiment, the interconnect is formed by first provisioning a protective layer over an area to be protected (gate dielectric or other sensitive material) of upper transistor, and then etching material adjacent and below the protected area to expose an underlying contact point of lower transistor. A metal is deposited into the void created by the etch to provide the interconnect. The protective layer is resistant to the etch process and is preserved in the structure, and in some cases may be utilized as a work-function metal. In an embodiment, the protective layer is formed by deposition of reactive semiconductor and metal material layers which are subsequently transformed into a work function metal or work function metal-containing compound. A remnant of unreacted reactive semiconductor material may be left in structure and collinear with protective layer.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Aaron D. Lilak, Anh Phan, Ehren Mannebach, Cheng-Ying Huang, Stephanie A. Bojarski, Gilbert Dewey, Orb Acton, Willy Rachmady
  • Patent number: 11996942
    Abstract: An apparatus and system to enable URLLC PUSCH repetitions in the unlicensed spectrum are described. The number of consecutive PUSCH repetitions indicated in the RRC parameter is reinterpreted as the number of transmission occasions over which the UE is able to attempt CCA. An orphan symbol is used to provide a DMRS transmission or cyclic prefix of the PUSCH transmission causing the orphan symbol. Whether a CG-UCI is piggybacked in a PUSCH transmission, and whether DCI-DFI is used, is dependent on whether cg-RetransmissionTimer is configured.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Salvatore Talarico, Sergey Panteleev, Debdeep Chatterjee, Toufiqul Islam
  • Patent number: 11989595
    Abstract: An apparatus to facilitate disaggregated computing for a distributed confidential computing environment is disclosed. The apparatus includes one or more processors to: provide a remote GPU middleware layer to act as a proxy for an application stack on a client platform separate from the apparatus; communicate, by the remote GPU middleware layer, with a kernel mode driver of the one or more processors to cause the host memory to be allocated for command buffers and data structures received from the client platform for consumption by a command streamer of a remote GPU of the apparatus; and invoke, by the remote GPU middleware layer, the kernel mode driver to submit a workload generated by the application stack, the workload submitted for processing by the remote GPU using the command buffers and the data structures allocated in the host memory as directed by the command streamer.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Reshma Lal, Pradeep Pappachan, Luis Kida, Soham Jayesh Desai, Sujoy Sen, Selvakumar Panneer, Robert Sharp
  • Patent number: 11989587
    Abstract: An apparatus and method for dynamic resource allocation with mile/performance markers.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Rameshkumar Illikkal, Andrew J. Herdrich, Francesc Guim Bernat, Ravishankar Iyer
  • Patent number: 11989573
    Abstract: Techniques for providing adaptive virtual function (VF) drivers capable of operating with physical devices having a plurality of different hardware configurations are described. In one embodiment, for example, an apparatus may include logic to implement a virtual machine (VM), the logic to initialize an adaptive virtual function (VF) driver to facilitate communication between the VM and a physical device to be virtualized, establish communication between the adaptive VF driver and a physical function (PF) driver of the hypervisor for the physical device, activate a standard feature set for the adaptive VF driver to execute on a PF of the physical device, and negotiate activation of an advanced feature set for the adaptive VF driver to execute on the PF, the adaptive VF driver to provide the advanced feature set to the PF, the PF activate each feature of the advanced feature set supported by the PF.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Anjali Singhai Jain, Mitu Aggarwal, Parthasarathy Sarangam, Donald Wood, Jesse Brandeburg, Mitchell A. Williams
  • Patent number: 11989861
    Abstract: A mechanism is described for facilitating deep learning-based real-time detection and correction of compromised sensors in autonomous machines according to one embodiment. An apparatus of embodiments, as described herein, includes detection and capturing logic to facilitate one or more sensors to capture one or more images of a scene, where an image of the one or more images is determined to be unclear, where the one or more sensors include one or more cameras. The apparatus further comprises classification and prediction logic to facilitate a deep learning model to identify, in real-time, a sensor associated with the image.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Wenlong Yang, Tomer Rider, Xiaopei Zhang
  • Patent number: 11989074
    Abstract: An apparatus is provided, where the apparatus includes a plurality of components; a first sensing system to measure first power consumed by first one or more components of the plurality of components; a second sensing system to measure second power consumed by the apparatus; an analog-to-digital converter (ADC) to generate an identification (ID) that is representative of the second power consumed by the apparatus; and a controller to allocate power budget to one or more components of the plurality of components, based on the measurement of the first power and the ID.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Dorit Shapira, Anand Enamandram, Daniel Cartagena, Krishnakanth Sistla, Jorge P. Rodriguez, Efraim Rotem, Nir Rosenzweig
  • Patent number: 11989817
    Abstract: Apparatus and method for more precise level-of-details transitions. For example one embodiment includes a graphics processor comprising: ray traversal hardware logic to traverse a ray through an acceleration structure to determine intersections between the ray and one or more object instances; and a level of detail selector to: set an instance comparison mask associated with an object instance to a first level of detail (LOD), the instance comparison mask comprising an N-bit value and one or more bits to indicate a type of comparison operation, compare a value from a ray mask with the N-bit value in accordance with the type of comparison operation to generate a comparison result, and determine whether to use the first LOD or a second LOD to render one or more pixels in accordance with the comparison result.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Holger Gruen, Karthik Vaidyanathan
  • Patent number: 11989106
    Abstract: In a memory system, a memory device has a memory array with multiple rows of memory having logical addresses mapped to their physical addresses and at least one spare row not having a logical address mapped to its physical address. A controller detects a failure of one of the multiple rows of memory (“failure row”) and executes a post package repair (PPR) mode. The controller can be internal to the memory device or external to the memory device. The memory device includes an internal scratchpad to allow transfer of data contents from the failure row to the spare row. The controller can map the logical address of the failure row from the physical address of the failure row to the physical address of the spare row, transfer data contents from the failure row to the internal scratchpad, and transfer the data contents from the internal scratchpad to the spare row.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Jongwon Lee, Kuljit S. Bains
  • Patent number: 11989076
    Abstract: In an example, an apparatus comprises logic, at least partially comprising hardware logic, to power on a first set of processing clusters, dispatch a workload to the first set of processing clusters, detect a full operating state of the first set of processing clusters, and in response to the detection of a full operating state of the first set of processing clusters, to power on a second set of processing clusters. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Balaji Vembu, Josh B. Mastronarde, Nikos Kaburlasos
  • Patent number: 11989553
    Abstract: Technologies for performing random sparse lifting and Procrustean orthogonal sparse hashing using column read-enabled memory include a device that has a memory that is column addressable and circuitry connected to the memory. The circuitry is configured to add a set of input data vectors to the memory as a set of binary dimensionally expanded vectors, including multiplying each input data vector with a projection matrix. The circuitry is also configured to produce a search hash code from a search data vector, including multiplying the search data vector with the projection matrix. Further, the circuitry is configured to determine a Hamming distance between the search hash code and each of the binary dimensionally expanded vectors.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Mariano Tepper, Dipanjan Sengupta, Sourabh Dongaonkar, Chetan Chauhan, Jawad Khan, Theodore Willke, Richard Coulson
  • Patent number: 11989815
    Abstract: Cluster of acceleration engines to accelerate intersections.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Prasoonkumar Surti, Carsten Benthin, Karthik Vaidyanathan, Philip Laws, Scott Janus, Sven Woop
  • Patent number: 11989129
    Abstract: Systems, apparatuses and methods may provide for technology that identifies a NUMA node, defines a first virtual proximity domain within the NUMA node, and defines a second virtual proximity domain within the NUMA node, wherein the first virtual proximity domain and the second virtual proximity domain are defined via one or more OS interface tables.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Kyle Delehanty, Sridharan Sakthivelu, Janardhana Yoga Narasimhaswamy, Vijay Bahirji, Toby Opferman
  • Patent number: 11990513
    Abstract: Gate-all-around integrated circuit structures having embedded GeSnB source or drain structures, and methods of fabricating gate-all-around integrated circuit structures having embedded GeSnB source or drain structures, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires above a fin, the fin including a defect modification layer on a first semiconductor layer, and a second semiconductor layer on the defect modification layer. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires, and a second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Cory Bomberger, Anand Murthy, Susmita Ghose, Siddharth Chouksey
  • Patent number: 11989135
    Abstract: Examples described herein relate to a computing system supporting custom page sized ranges for an application to map contiguous memory regions instead of many smaller sized pages. An application can request a custom range size. An operating system can allocate a contiguous physical memory region to a virtual address range by specifying a custom range sizes that are larger or smaller than the normal general page sizes. Virtual-to-physical address translation can occur using an address range circuitry and translation lookaside buffer in parallel. The address range circuitry can determine if a custom entry is available to use to identify a physical address translation for the virtual address. Physical address translation can be performed by transforming the virtual address in some examples.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Farah E. Fargo, Mitchell Diamond, David Keppel, Samantika S. Sury, Binh Pham, Shobha Vissapragada
  • Patent number: 11990395
    Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a package substrate with a top surface, a corner portion, and a plurality of solder balls on the top surface of the package substrate. The semiconductor package also includes a pattern on the corner portion of the package substrate. The pattern may have a width substantially equal to a width of the solder balls. The pattern may also include a continuous line having solder materials. The semiconductor package may include a plurality of conductive pads on the package substrate. The conductive pads may be coupled to the pattern. The pattern may have a z-height that is substantially equal to a z-height of the solder balls, and have one or more outer edges, where the outer edges of the pattern are sidewalls. The sidewalls of the pattern may be substantially vertical or tapered sidewalls.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Xiaoying Tang, Zhicheng Ding, Bin Liu, Yong She, Zhijun Xu
  • Patent number: 11989555
    Abstract: Disclosed embodiments relate to atomic memory operations. In one example, a method of executing an instruction atomically and with weak order includes: fetching, by fetch circuitry, the instruction from code storage, the instruction including an opcode, a source identifier, and a destination identifier, decoding, by decode circuitry, the fetched instruction, selecting, by a scheduling circuit, an execution circuit among multiple circuits in a system, scheduling, by the scheduling circuit, execution of the decoded instruction out of order with respect to other instructions, with an order selected to optimize at least one of latency, throughput, power, and performance, and executing the decoded instruction, by the execution circuit, to: atomically read a datum from a location identified by the destination identifier, perform an operation on the datum as specified by the opcode, the operation to use a source operand identified by the source identifier, and write a result back to the location.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Doddaballapur N. Jayasimha, Jonas Svennebring, Samantika S. Sury, Christopher J. Hughes, Jong Soo Park, Lingxiang Xiang
  • Patent number: 11990403
    Abstract: Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication, and the resulting structures, are described. In an example, a semiconductor structure includes a substrate. A plurality of alternating first and second conductive line types is disposed along a same direction of a back end of line (BEOL) metallization layer disposed in an inter-layer dielectric (ILD) layer disposed above the substrate. A dielectric layer is disposed on an uppermost surface of the first conductive line types but not along sidewalls of the first conductive line types, and is disposed along sidewalls of the second conductive line types but not on an uppermost surface of the second conductive line types.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Kevin L. Lin, Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani, Manish Chandhok
  • Patent number: 11989554
    Abstract: Techniques are disclosed for reducing or eliminating loop overhead caused by function calls in processors that form part of a pipeline architecture. The processors in the pipeline process data blocks in an iterative fashion, with each processor in the pipeline completing one of several iterations associated with a processing loop for a commonly-executed function. The described techniques leverage the use of message passing for pipelined processors to enable an upstream processor to signal to a downstream processor when processing has been completed, and thus a data block is ready for further processing in accordance with the next loop processing iteration. The described techniques facilitate a zero loop overhead architecture, enable continuous data block processing, and allow the processing pipeline to function indefinitely within the main body of the processing loop associated with the commonly-executed function where efficiency is greatest.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Kameran Azadet, Jeroen Leijten, Joseph Williams
  • Patent number: 11991265
    Abstract: A wireless communication device for asymmetrical frequency spreading including a processor configured to receive a frequency band message comprising a maximum difference and a minimum difference, wherein the maximum difference is between a maximum frequency of a sub-band and a signal frequency, and wherein the minimum difference is between the minimum frequency of the sub-band and the signal frequency compare the maximum difference and the minimum difference with each other; and generate a frequency shift based on the comparison.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Elan Banin, Evgeny Shumaker, Ofir Degani, Rotem Banin, Shahar Gross