Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a bottom electrode layer over a substrate. A magnetic tunnel junction (MTJ) layers are formed over the bottom electrode layer. A top electrode layer is formed over the MTJ layers. The top electrode layer is patterned. After patterning the top electrode layer, one or more process cycles are performed on the MTJ layers and the bottom electrode layer. A patterned top electrode layer, patterned MTJ layers and a patterned bottom electrode layer form MTJ structures. Each of the one or more process cycles includes performing an etching process on the MTJ layers and the bottom electrode layer for a first duration and performing a magnetic treatment on the MTJ layers and the bottom electrode layer for a second duration.

Abstract: Provided is a method of operating a magnetic memory system. The method of operating the magnetic memory system includes: preparing a plurality of magnetic memory cells; classifying the magnetic memory cells into a plurality of magnetic memory cell groups by using program current values of the magnetic memory cells; constructing a magnetic memory system by hierarchizing the magnetic memory cell groups; and primarily performing programming by selecting one magnetic memory cell group from the hierarchized magnetic memory cell groups according to an external temperature.

Abstract: A computing device operating system providing a plurality of secure domains. A domain manager selectively creates a plurality of secure domains, and one of the secure domains is selected as a current domain. A domain policy service stores and enforces, for each secure domain, a policy comprising a rule set controlling access to files and applications associated with the domain. A package manager enforces, for each secure domain, installation of the applications associated with the domain. A domain message service provides communication between running processes associated with different ones of the secure domains. An activity manager selectively switches the current domain. Domain isolation is achieved while enabling a unified user interface providing concurrent access to the resources of multiple domains.

Abstract: Methods, systems, and devices for enabling fast pulse operation are described. A threshold voltage of a selection component and a requisite duration for a voltage applied to a selection component to reach a threshold voltage in response to a voltage generated by an external source may be determined. The threshold voltage may correspond to a voltage at which the selection component is configured to release electric charge. A voltage may then be generated and applied to an access line that is in electronic communication with the selection component and a memory cell for at least the requisite duration. Electric charge may be stored at the selection component during the requisite duration and transferred to memory cell after the requisite duration.

Abstract: A magnetic memory pillar structure having a plurality of magnetic memory elements connected in series, wherein switching of individual memory elements in the pillar structure can be accomplished based on differing switching current values of the magnetic memory elements. Each of the plurality of memory elements advantageously have similar retention values in spite of the different switching current values (latency values) as a result of a precessional spin current injection structure provided in the memory element or memory elements having the lower switching current value.

Abstract: A magnetic device, according to one approach, includes: a plurality of perpendicular magnetic tunnel junction (p-MTJ) cells, each p-MTJ cell having a transistor and a magnetic tunnel junction (MTJ) sensor. Moreover, each of the transistors includes a drain terminal, a source terminal, and a gate terminal. The magnetic device also includes: a first common word line coupled to the gate terminal of each transistor in a first subset of the plurality of p-MTJ cells, a first common bit line coupled to a first end of each MTJ sensor in a second subset of the plurality of p-MTJ cells, and a first common source line coupled to the drain terminal of each transistor in the first subset. A second end of each of the MTJ sensors in the second subset is coupled to the source terminal of each respective transistor in the second subset.

Abstract: A one time programming (OTP) apparatus unit cell includes magnetic tunnel junctions (MTJs) with reversed connections for placing the MTJ in an anti-parallel resistance state during programming. Increased MTJ resistance in its anti-parallel resistance state causes a higher programming voltage which reduces programming time and programming current.

Abstract: A compensation circuit for constant output voltage is disclosed. The compensation circuit comprises a current source, a first switch, a controllable current source, a second switch, a logic NOT gate, a CV loop control module, and an input voltage detection module. The compensation circuit ensures a normal start-up, and substantially no additional power dissipation of the converter is generated at no load. Furthermore, the compensation circuit adjusts a compensation current according to at least one of a detected input voltage of the power supply converter and a working mode of the transformer, to obtain better precision of constant output voltage. The compensation circuit can be applied to occasions where extremely small standby input power dissipation or extremely high precision of constant output voltage is required.

Abstract: A one time programming (OTP) apparatus unit cell includes magnetic tunnel junctions (MTJs) with reversed connections for placing the MTJ in an anti-parallel resistance state during programming. Increased MTJ resistance in its anti-parallel resistance state causes a higher programming voltage which reduces programming time and programming current.

Abstract: Devices and methods of forming a device are disclosed. The method includes providing a substrate defined with at least first and second regions. A first upper dielectric layer is provided over the substrate. The first upper dielectric layer comprises a first upper interconnect level with a plurality of metal lines. A dielectric layer is formed over the first upper dielectric layer. The dielectric layer includes a second upper interconnect level with a plurality of metal lines. A magnetic random access memory (MRAM) cell is formed between the first and second upper interconnect levels in the first region. An inductor is formed in the second region. The inductor includes a lower inductor level formed from metal lines in the first upper interconnect level and an upper inductor level formed from metal lines in the second upper interconnect level. The metal lines in the lower inductor level and upper inductor level are coupled by via contacts to form loops of the inductor.

Abstract: Methods of forming memory cells, magnetic memory cell structures, and arrays of magnetic memory cell structures are disclosed. Embodiments of the methods include patterning a precursor structure to form a stepped structure including at least an upper discrete feature section and a lower feature section with a broader width, length, or both than the upper discrete feature section. The method uses patterning acts directed along a first axis, e.g., an x-axis, and then along a second axis, e.g., a y-axis, that is perpendicular to or about perpendicular to the first axis. The patterning acts may therefore allow for more unifoimity between a plurality of formed, neighboring cell core structures, even at dimensions below about thirty nanometers. Magnetic memory structures and memory cell arrays are also disclosed.

Abstract: A semiconductor device includes a MRAM chip including a semiconductor substrate and a memory cell array area includes magnetoresistive elements which are provided on the semiconductor substrate, and a magnetic shield layer surrounding the memory cell array area in a circumferential direction of the MRAM chip, and having a closed magnetic path.

Abstract: According to one embodiment, a semiconductor device includes a MRAM chip including a semiconductor substrate and a memory cell array area includes magnetoresistive elements which are provided on the semiconductor substrate, and a magnetic shield layer surrounding the memory cell array area in a circumferential direction of the MRAM chip, and having a closed magnetic path.

Abstract: A semiconductor device 100 includes a plurality of vertical transistors 50 provided to stand from a silicon substrate 1 and having a pillar lower diffusion layer 9 at their end portions on the silicon substrate 1 side, a metal contact plug 31 provided to stand from the silicon substrate 1 and connected to the pillar lower diffusion layer 9 of the plurality of vertical transistors 50, the plurality of vertical transistors 50 are uniformly arranged around the metal contact plug 31 and share the pillar lower diffusion layer 9 and the metal contact plug 31.

Abstract: A resistive memory cell includes a switch and a resistive switching device. The switch includes a first terminal connected to a select line and a gate terminal connected to a word line. The resistive switching device is connected between a second terminal of the switch and a bit line. The resistive switching device is resettable by having a positive bias applied to the word line and a negative bias applied to the bit line.

Abstract: Hybrid resistive memory devices and methods of operating and manufacturing the same, include at least two resistive memory units. At least one of the at least two resistive memory units is a resistive memory unit configured to operate in a long-term plasticity state.

Abstract: The present disclosure provides one embodiment of a method for operating a resistive random access memory (RRAM) cell. The method includes performing a forming operation to the RRAM cell with a forming voltage; performing a number of set/reset operation cycles to the RRAM cell; and performing a recreating process to the RRAM cell to recover RRAM resistance by applying a recreating voltage. Each of the number of set/reset operation cycles includes a set operation with a set voltage. The recreating voltage is greater than the set voltage.

Abstract: A method for the control of the magnetic states of interacting magnetic elements comprising providing a magnetic structure with a plurality of interacting magnetic elements. The magnetic structure comprises a plurality of magnetic states based on the state of each interacting magnetic element. The desired magnetic state of the magnetic structure is determined. The active resonance frequency and amplitude curve of the desired magnetic state is determined. Each magnetic element of the magnetic structure is then subjected to an alternating magnetic field or electrical current having a frequency and amplitude below the active resonance frequency and amplitude curve of said desired magnetic state and above the active resonance frequency and amplitude curve of the current state of the magnetic structure until the magnetic state of the magnetic structure is at the desired magnetic state.

Abstract: A variable resistance memory device has memory cells that are operated by Joule's heat and which are highly thermally efficient. Conductive patterns are formed on a substrate; sacrificial patterns exposing a portion of the top surface of each of the conductive patterns are formed on the conductive patterns, lower electrodes are formed by etching upper portions of the conductive patterns using the sacrificial patterns as an etching mask, then mold patterns are formed on the lower electrodes and cover exposed sidewall surfaces of the sacrificial patterns, and then the sacrificial patterns are replaced with variable resistance patterns.

Abstract: A method and system for providing a magnetic junction usable in a magnetic device are described. The magnetic junction includes a pinned layer, a nonmagnetic spacer layer, and a free layer. The nonmagnetic spacer layer is between the pinned layer and the free layer. The free layer has a magnetic anisotropy, at least a portion of which is a biaxial anisotropy. The magnetic junction is configured such that the free layer is switchable between a plurality of stable magnetic states when a write current is passed through the magnetic junction.

Abstract: A magnetic device includes a magnetic layer having a variable direction of magnetization, and a first antiferromagnetic layer in contact with the magnetic layer, the first antiferromagnetic layer being able to trap the direction of magnetization of the magnetic layer. The magnetic device also includes a layer made of a ferromagnetic material in contact with the first antiferromagnetic layer through its face opposite to the magnetic layer, the directions of magnetization of the magnetic and ferromagnetic layers being substantially perpendicular. A first layer among the magnetic and ferromagnetic layers has a magnetization, the direction of which is oriented in the plane of the first layer whereas the second of the two layers among the magnetic and ferromagnetic layers has a magnetization, the direction of which is oriented outside of the plane of the second layer.

Abstract: In one embodiment of the invention, there is provided a method for operating a magnetic memory device. The method comprises selecting a subset of magnetic memory cells of the magnetic memory device; applying a first programming voltage to the selected subset of cells for a predetermined amount of time, wherein the programming voltage is selected to exceed a threshold operating voltage thereby to cause irreversible breakdown of the subset of cells; and reading selected cells of the magnetic memory device by passing a read current through a diode connected in series with each magnetic memory cell.

Abstract: A magnetic detecting element includes a laminated structure where a fixed magnetic layer and a free magnetic layer are laminated through a non-magnetic material layer, wherein the fixed magnetic layer is a self-pinned type where a first magnetic layer and a second magnetic layer are laminated through a non-magnetic intermediate layer and the first magnetic layer and the second magnetic layer are antiparallelly magnetization-fixed, and the second magnetic layer is in contact with the non-magnetic material layer. The first magnetic layer is formed using FeCo serving as a material having a higher coercive force than the second magnetic layer. The film thickness of the first magnetic layer falls within a range greater than or equal to 10 ? and less than or equal to 17 ?, and is thinner than the film thickness of the second magnetic layer. The non-magnetic intermediate layer is formed using Rh.

Abstract: Hydro-carbon nanorings may be used in storage. Sufficiently cooled, an externally hydrogen doped carbon nanoring may be used to create a radial dipole field to contain streams of electrons. Similarly, an internally hydrogen doped carbon nanoring may be used to create a radial dipole field to contain streams of positrons. When matched streams of positrons and electrons are sufficiently compressed they may form Cooper pairs with magnetic moments aligned to the movement of the stream. Matched adjacent Cooper pairs of electrons and positrons may contain information within their magnetic moments, and as such, may transmit and store information with little or no energy loss.

Abstract: A low read current architecture for memory. Bit lines of a cross point memory array are allowed to be charged by a selected word line until a minimum voltage differential between a memory state and a reference level is assured.

Abstract: A one time programmable (OPT) and multiple time programmable (MTP) structure is constructed in a back end of line (BEOL) process using only one, two or three masks. The OTP/MTP structure can be programmed in one of three states, a pre-programmed high resistance state, and a programmable low resistance state and a programmable very high resistance state. In the programmable low resistance state, a barrier layer is broken down during an anti-fuse programming so that the OTP/MTP structure exhibits resistance in the hundred ohm order of magnitude. In the very high resistance state a conductive fuse is blown open during programming so that the OTP/MTP structure exhibits resistance in the mega-ohm order of magnitude. The OTP/MTP structure may include a magnetic tunnel junction (MTJ) structure or a metal-insulator-metal (MIM) capacitor structure.

Abstract: A magnetic random access memory (MRAM) cell including a magnetic tunnel junction including a tunnel barrier layer between a first magnetic layer having a first magnetization direction, and a second magnetic layer having a second adjustable magnetization to vary a junction resistance of the magnetic tunnel junction from a first to a second junction resistance level; said magnetic tunnel junction further including a switching resistant element electrically connected to the magnetic tunnel junction and having a switching resistance switchable from a first to a second switching resistance level when a switching current is passed through the switching resistant element, such that a resistance of the MRAM cell can have at least four different cell resistance levels depending of the resistance level of the junction resistance and the switching resistance. The disclosed MRAM cell achieves improved read margin and allows for writing at least four different cell resistance levels.

Abstract: Provided is a spin valve element capable of performing multi-value recording, which includes a pair of ferromagnetic layers having different coercivities from each other, and sandwiching an insulating layer or a non-magnetic layer. The ferromagnetic layer having the smaller coercivity has a substantially circular in-plane profile, and a plurality of island-shaped non-magnetic portions IN, IE, IW, and IS are included. In addition, a storage device is manufactured by using such a spin valve element.

Abstract: Provided are a spin-injection element having high spin-injection efficiency, and a magnetic field sensor and a magnetic recording memory employing the element. The element comprises a barrier layer, a magnetic conductive layer, and a spin accumulation portion comprised of non-magnetic conductive material. In the element, a first spin accumulation layer (103) and the barrier layer (102) have respectively a body-centered cubic lattice structure. Due to this, the first spin accumulation layer (103) and the barrier layer (102) come into contact with each other through a boundary face with improved crystalline symmetry. Thereby, lattice matching is improved and scattering of the tunnel electrons in the ?1 band is prevented, resulting in improvement in the spin polarizability. Further, the characteristics of the device employing the spin injection element are improved.

Abstract: A memory array includes a plurality of magneto-resistive changing memory cells. Each resistive changing memory cell is electrically between a source line and a bit line and a transistor electrically between the resistive changing memory cell and the bit line. The transistor has a gate electrically between a source region and a drain region and the source region being electrically between the r magneto-resistive changing memory cell and the gate. A word line is electrically coupled to the gate. A bit line charge accumulation sensing for magneto-resistive changing memory is also disclosed.

Abstract: A method of adjusting a resistive change element using a reference is disclosed. The method comprises inspecting a resistive change element to determine a first state; comparing the first state to a reference wherein said reference provides stimulus parameters corresponding to a transition from the first state to a second state; and applying the stimulus parameters to the resistive change element. A resistive change memory cell array is also disclosed.

Abstract: A magnetic memory device includes a free layer and a guide layer on a substrate. An insulating layer is interposed between the free layer and the guide layer. At least one conductive bridge passes through the insulating layer and electrically connects the free layer and the guide layer. A diffusion barrier may be interposed between the guide layer and the insulating layer. The device may further include a reference layer having a fixed magnetization direction on a side of the free layer opposite the insulating layer and a tunnel barrier between the reference layer and the free layer. Related fabrication methods are also described.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes a memory cell array configured by plural memory cells each including a variable resistor and each provided between first and second lines. A control circuit applies to a memory cell through the first and second lines a writing voltage for writing data or a reading voltage for reading data. A sense amplifier circuit senses data retained in a memory cell based on a current flowing through the first line. In a data writing operation, the control circuit applies a writing voltage to each of n number of memory cells configuring one unit such that the memory cells may be supplied with different resistance values. In a data reading operation, the sense amplifier circuit compares level relationship of the resistance values of n number of memory cells configuring one unit and reads out n! patterns of data from the one unit.

Abstract: Techniques are provided for programming a spin torque transfer magnetic random access memory (STT-MRAM) cell using a unidirectional and/or symmetrical programming current. A unidirectional programming current flows through the free region of the STT-MRAM cell in one direction to switch the magnetization of the free region in at least two different directions. A symmetrical programming current switches the magnetization of the free region to either of the two different directions using a substantially similar current magnitude. In some embodiments, the STT-MRAM cell includes two fixed regions, each having fixed magnetizations in opposite directions and a free region configured to be switched in magnetization to be either parallel with or antiparallel to the magnetization of one of the fixed regions. Switching the free region to different magnetization directions may involve directing the programming current through one of the two oppositely magnetized fixed regions.

Abstract: A semiconductor memory device with a variable resistance element includes a plurality of active areas isolated from one another by an isolation layer formed in a substrate, a plurality of word lines crossing over the plurality of active areas, an auxiliary source line disposed between two selected word lines and commonly connected to at least two active areas among the plurality of active areas between the two selected word lines, and a plurality of contact plugs each connected to a corresponding active area.

Abstract: A programmable memory array is disclosed in which the phase change memory cells are self-aligned at the access devices and at the cross-points of the bit lines and the word lines. A method for making the array employs one line mask to define the bit lines and another line mask to define the word lines. The front end of line (FEOL) memory cell elements are in the same layer as the polysilicon gates. The bit lines and the word lines intersect over the devices, and the memory cell elements are formed at the intersections of the bit lines and the word line.

Abstract: Read and write operations of a non-volatile memory (NVM) bitcell have different optimum parameters resulting in a conflict during design of the NVM bitcell. A single bitline in the NVM bitcell prevents optimum read performance. Read performance may be improved by splitting the read path and the write path in a NVM bitcell between two bitlines. A read bitline of the NVM bitcell has a low capacitance for improved read operation speed and decreased power consumption. A write bitline of the NVM bitcell has a low resistance to handle large currents present during write operations. A memory element of the NVM bitcell may be a fuse, anti-fuse, eFUSE, or magnetic tunnel junction. Read performance may be further enhanced with differential sensing read operations.

Abstract: A high speed and low power method to control and switch the magnetization direction and/or helicity of a magnetic region in a magnetic device for memory cells using spin polarized electrical current. The mapetic device comprises a reference magnetic layer with a fixed magnetic helicity and/or magnetization direction and a free magnetic layer with a changeable magnetic helicity and/or magnetization direction. The fixed magnetic layer and the free magnetic layer are preferably separated by a non-magnetic layer. The fixed and free magnetic layers may have magnetization directions at a substantially nonzero angle relative to the layer normal. A current can be applied to the device to induce a torque that alters the magnetic state of the device so that it can act as a magnetic memory for writing information. The resistance, which depends on the magnetic state of the device, is measured to read out the information stored in the device.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a power supply circuit, an interconnection and a discharging circuit. The memory cell includes a variable resistance element whose resistance varies by application of a voltage. The power supply circuit outputs the voltage to be applied to the memory cell. The interconnection is formed between the power supply circuit and the memory cell and supplies the voltage output from the power supply circuit to the memory cell. The discharging circuit is connected to the interconnection. The discharging circuit discharges electric charge accumulated in the interconnection after a first operation of applying the voltage to the memory cell is ended and before a second operation of applying the voltage to the memory cell next is started.

Abstract: A current steering element which can prevent occurrence of write disturb even when electric pulses having different polarities are applied and can cause large current to flow through a variable resistance element, and with which data can be written without problem. In a storage element (3) including: a variable resistance element (1) whose electric resistance value changes in response to application of electric pulses having a positive polarity and a negative polarity and which maintains the changed electric resistance value; and the current steering element (2) that steers current flowing through the variable resistance element (1) when the electric pulses are applied, the current steering element (2) includes: a first electrode (32); a second electrode (31); and a current steering layer (33) interposed between the first electrode (32) and the second electrode (31). When the current steering layer (33) includes SiNx (0<x?0.

Abstract: A memory device is described that comprises a plurality of bit lines and an array of vertical transistors arranged on the plurality of bit lines. A plurality of word lines is formed along rows of vertical transistors in the array which comprise thin film sidewalls of word line material and arranged so that the thin film sidewalls merge in the row direction, and do not merge in the column direction, to form word lines. The word lines provide “surrounding gate” structures for embodiments in which the vertical transistors are field effect transistors. Memory elements are formed in electrical communication with the vertical transistors. A fully self-aligned process is provided in which the word lines and memory elements are aligned with the vertical transistors without additional patterning steps.

Abstract: A semiconductor memory device comprises a memory cell, first and second voltage generating circuits generating first and second voltages, and a control circuit. A memory element and a diode included in the memory cell are connected in series between first and second lines. The first voltage has no temperature dependence, and the second voltage has a temperature dependence opposite to that of a forward voltage of the diode. The control circuit detects a resistance state of the memory element in accordance with a change in current flowing in the memory cell in a state where the first/second voltage is applied to the first/second in a read operation of the memory cell.

Abstract: A magnetic tunnel junction cell having a free layer, a ferromagnetic pinned layer, and a barrier layer therebetween. The free layer has a central ferromagnetic portion and a stabilizing portion radially proximate the central ferromagnetic portion. The construction can be used for both in-plane magnetic memory cells where the magnetization orientation of the magnetic layer is in the stack film plane and out-of-plane magnetic memory cells where the magnetization orientation of the magnetic layer is out of the stack film plane, e.g., perpendicular to the stack plane.

Abstract: A method of forming an integrated circuit structure includes forming a bottom electrode layer over a substrate; forming magnetic tunnel junction (MTJ) layers over the bottom electrode layer; patterning the MTJ layers to form a MTJ stack; forming a dielectric layer covering the MTJ stack; forming an opening in the dielectric layer to expose a portion of the MTJ stack; filling the opening with a top electrode material; and performing a planarization to the top electrode material. After the step of performing the planarization, the top electrode material and the dielectric layer are patterned, wherein a first portion of the top electrode material in the opening forms a top electrode, and a second portion of the top electrode material forms a metal strip over the dielectric layer and connected to the top electrode.

Abstract: A magnetic device includes a magnetic reference layer with a fixed magnetization direction located either in the plane of the layer or perpendicular to the plane of the layer, a magnetic storage layer with a variable magnetization direction, a non-magnetic spacer separating the reference layer and the storage layer and a magnetic spin polarizing layer with a magnetization perpendicular to that of the reference layer, and located out of the plane of the spin polarizing layer if the magnetization of the reference layer is directed in the plane of the reference layer or in the plane of the spin polarizing layer if the magnetization of the reference layer is directed perpendicular to the plane of the reference layer. The spin transfer coefficient between the reference layer and the storage layer is higher than the spin transfer coefficient between the spin polarizing layer and the storage layer.

Abstract: Semiconductor devices are provided including a plurality of L-shaped cell blocks each including a cell array and a plurality of decoders disposed in horizontal and vertical directions of the cell array. The plurality of L-shaped cell blocks is oriented in a diagonal direction intersecting the horizontal and vertical directions. Related methods are also provided herein.

Abstract: A magnetic tunneling junction (MTJ) device and fabrication method is disclosed. In a particular embodiment, an apparatus is disclosed that includes an MTJ device. The MTJ device includes a barrier layer, a free layer, and a magnesium (Mg) capping layer. The free layer is positioned between the barrier layer and the magnesium (Mg) capping layer.

Abstract: A magnetic structure includes a first portion and a plurality of second portions. The first portion extends in a first direction. The plurality of second portions extend from ends of the first portion in a second direction. The first and second directions are perpendicular to one another. Two magnetic domains magnetized in directions opposite to each other and a magnetic domain wall between the magnetic domains are formed in the magnetic structure.

Abstract: The invention relates to a read only magnetic information carrier (1b, 1c, 1d) comprising a substrate (2), an information layer (3) and a stabilizing layer (15a, 15b). The information layer (3) comprises a pattern of magnetic bits (4) of magnetic material wherein the pattern of magnetic bits (4) constitutes an array of bit locations. The presence or absence of the magnetic material at a bit location represents a value of the bit location by a magnetic field (5) having a predetermined magnetization direction (6). The stabilizing layer (15a, 15b) is arranged between the substrate (2) and the information layer (3) and comprises hard magnetic material (8, 9) which is magnetically coupled to the magnetic material of the magnetic bit (4). The magnetically coupled hard magnetic material (8, 9) provides the predetermined magnetization direction (6) of the magnetic field (5).

Abstract: A memory array includes a plurality of magneto-resistive changing memory cells. Each resistive changing memory cell is electrically between a source line and a bit line and a transistor electrically between the resistive changing memory cell and the bit line. The transistor has a gate electrically between a source region and a drain region and the source region being electrically between the magneto-resistive changing memory cell and the gate. A word line is electrically coupled to the gate. A bit line charge accumulation sensing for magneto-resistive changing memory is also disclosed.