Abstract: A semiconductor device includes a fuse unit connected to a detection node and configured to be programmed in response to a first voltage supplied through the detection node, an output unit connected to the detection node and configured to output a fuse information signal indicating whether the fuse unit is programmed or not, and a blocking unit configured to block the first voltage supplied through the detection node in response to the fuse information signal.

Abstract: A technique for detecting tampering attempts directed at a memory device includes setting each of a plurality of detection memory cells to an initial predetermined state, where corresponding portions of the plurality of detection memory cells are included in each of the arrays of data storage memory cells on the memory device. A plurality of corresponding reference bits on the memory device permanently store information representative of the initial predetermined state of each of the detection memory elements. When a tamper detection check is performed, a comparison between the reference bits and the current state of the detection memory cells is used to determine whether any of the detection memory cells have changed state from their initial predetermined states. Based on the comparison, a tamper detect indication is flagged if a threshold level of change is determined.

Abstract: A method of switching a memristive device in a two-dimensional array senses a leakage current through the two-dimensional array when a voltage of half of a switching voltage is applied to a row line of the memristive device. A leakage compensation current is generated according to the sensed leakage current, and a switching current ramp is also generated. The leakage compensation current and the switching current ramp are combined to form a combined switching current, which is applied to the row line of the memristive device. When a resistance of the memristive device reaches a target value, the combined switching current is removed from the row line.

Abstract: A power-mode-aware (PMA) clock tree and a synthesis method thereof are provided. The clock tree includes a sub clock tree and a PMA buffer. The sub clock tree transmits a delayed clock signal to a function module, wherein a power mode of the function module is determined according to a power information. The PMA buffer is coupled to the sub clock tree. The PMA buffer determines the delay time of a system clock signal according to the power information delays the system clock signal, and outputs the delayed system clock signal to the sub clock tree as the delayed clock signal.

Abstract: A method for handling peripheral signals in an extensible three dimensional circuit includes forming an extensible three dimensional circuit with a plurality of stacked crossbar arrays and at least one class of traveling lines which travel vertically and laterally through the circuit. The method also includes alternating the traveling direction of bundles of traveling lines such that there are a substantially equal number of undriven lines and underutilized lines which exit out of a given side of the circuit and creating loopback traces which connect the undriven traveling lines and the underutilized traveling lines to form driven traveling lines with a full complement of memory elements and eliminate addressing gaps within the circuit.

Abstract: In an anti-fuse repair control circuit, a semiconductor memory device is integrated into a multi-chip package to perform an anti-fuse repair. An anti-fuse repair control circuit includes a data mask signal input circuit, a cell address enable unit a repair enable unit, and a repair unit. The data mask signal input circuit receives and outputs a data mask signal upon receiving a test control signal for an anti-fuse repair. The cell address enable unit receives an anti-fuse repair address to enable a cell address of an anti-fuse cell to be repaired upon receiving the data mask signal outputted from the data mask signal input circuit. The repair enable unit codes the cell address and output a repair enable signal and a drive signal according to whether or not an anti-fuse cell corresponding to the cell address is enabled. The repair unit supplies a repair voltage to the anti-fuse cell when the repair enable signal, the address, and the drive signal are enabled.

Abstract: A semiconductor memory device includes: an ID code memory circuit configured to store ID code data bits in a non-volatile manner; an ID code generating circuit configured to generate an ID code based on the data bits stored in the ID code memory circuit and output it to an external terminal; a power supply voltage detecting circuit configured to detect a power supply voltage supplied from the external and supply a select signal to at least one of the ID code memory circuit and ID code generating circuit for selectively generating one of ID codes, data bits of which are different from each other at least in part in correspondence with power supply voltage levels.

Abstract: Programmable surface control devices whose physical features, such as surface characteristics and mass distribution, are controlled by the presence or absence of an electrodeposition of metal and/or metal ions from a solid solution upon application of a suitable electric field.

Abstract: A semiconductor integrated circuit device includes a storage element, state sensing circuit, and control circuit. Information is programmed in the storage element by electrically irreversibly changing the element characteristics. The state sensing circuit is configured to sense the irreversibly changed state of the storage element in distinction from an unchanged state. The control circuit is configured to change the sensibility of the state sensing circuit.

Abstract: A semiconductor memory device having a bank for storing a data and a port as a data I/O terminal includes a transmitter for delivering the data inputted from the port; a global data bus for flowing an appearing current corresponding to the data outputted from the transmitter; and a receiver for sensing the appearing current by using a current-mirror and delivering the data corresponding to the sensed appearing current into the bank, wherein a swing range of a data bus voltage in response to the appearing current is narrower than a gap between a supply voltage and a ground.

Abstract: An exemplary four-transistor random access memory cell includes a first transistor of a first conductivity type having a gate coupled to a word line and a source coupled to a bit line, a second transistor of the first conductivity type having a gate coupled to a drain of the first transistor and a source coupled to receive a first voltage, a third transistor of a second conductivity type having a source coupled to a drain of the second transistor, a source coupled to receive a second voltage and a drain coupled to the drain of the first transistor, and a fourth transistor of the second type having a gate coupled to the drain of the first transistor, a source coupled to receive the second voltage and a drain coupled to the drain of the second transistor.

Abstract: In a programmable memory array, multiple memory cells on a single bit line may be tested in parallel for the unprogrammed state by simultaneously selecting multiple word lines associated with a selected bit line within a sub-array. A read current flowing through each selected memory cell is added on the selected bit line, and may be sensed using the same bit line sense circuits used for normal read operations. In the test mode, the sense circuit preferably indicates a pass/fail condition for all N simultaneously selected memory cells, which may be directly conveyed as an output signal, or may be combined with other similar pass/fail signals from other selected bit line sense circuits to generate a combined pass/fail output signal. Multiple bit lines may be simultaneously selected within the same sub-array.

Abstract: A method and related embedded memories are disclosed for utilizing voltage gradients to guide dielectric breakdowns for non-volatile memory elements. Non-volatile memory cells and associated programming methods are also disclosed that allow for the integration of non-volatile memory with other integrated circuitry utilizing the standard CMOS processing used to manufacture the CMOS circuitry. The non-volatile memory cell includes an antifuse element having a programming node and a capacitor coupled to the programming node. The antifuse element includes a MOS transistor having its source and drain connected to one or more voltage levels, having a gate that provides the programming node, and having a dielectric layer that provides an antifuse function by breaking down when subjected to a plurality of voltage pulses applied through the capacitor element. To guide the breakdown locations within the dielectric, one or more voltage gradients are generated within the antifuse element to concentration current flow.

Abstract: According to embodiments of the present invention, an antifuse circuit is operated by coupling an elevated voltage to a first terminal of an antifuse, controlling current in the antifuse with a program driver circuit coupled to a second terminal of the antifuse, and shunting current around the antifuse with a bypass circuit coupled between the first terminal of the antifuse and the program driver circuit to protect the antifuse. The antifuse includes a layer of gate dielectric between the first terminal and the second terminal. The embodiments of the present invention protect a gate dielectric antifuse.

Abstract: Novel capacitor top electrodes auto-self-aligned to bit-line regions is achieved with improved process yields. A first insulating layer is formed over the FETs, and a second insulating layer is deposited. Openings are etched for capacitors, and a novel photomask and etching are used to recess the second insulator. A first conducting layer is deposited for bottom electrodes, and a second photoresist is used to remove the first conducting layer on the top surfaces of the second insulating layer. A thin dielectric layer is deposited, and a second conducting layer is deposited, and polished back to form novel auto-self-aligned top electrodes to the second insulating layer for bit-line contact openings. This increases overlay margins, and the recessing of the second insulating layer in the first openings prevents polish-back damage to the bottom electrodes.

Abstract: An apparatus and associated method are provided to improve the programming of anti-fuse devices in an integrated circuit. A programming circuit capable of programming a plurality of anti-fuse devices in parallel permits a state-changing voltage to be applied to multiple anti-fuses substantially simultaneously using a common control signal.

Abstract: A semiconductor memory device is provided which enables faults in a word line to be redressed with almost no increase in chip size and which does not cause layout problems even in advanced miniaturization. A driver simultaneously drives four word lines. A memory cell connected to these word lines is selected by a selection transistor. Using wiring for connecting word lines, two adjacent word lines are connected at the far end as seen from the driver to form a loop. If a fault occurs at a location on a word line, the driver supplies a charge to the word line from the far end thereof to the fault location via the above wiring and the other word line. Therefore, the word potential at the far end past the fault location is at or above a memory cell threshold voltage, and the memory cell can be read correctly.

Abstract: An address program circuit 11 provided in a semiconductor memory device receives an internal address signal which corresponds to an address signal, and outputs a signal /RE1 for causing the switching operation from a defective memory cell to a redundant memory cell. One fuse of each pair of fuses F10-1 and F10-2, F11-1 and F11-2, . . . , F1n-1 and F1n-2 in each of selection portions S0, S1, . . . Sn is cut off in response to the address of the defective memory cell, thereby the signal /RE1 being made active upon receipt of a predetermined internal address signal. With this structure, the defective memory cell may be remedied without generating any complementary internal address corresponding to the address signal as inputted externally.